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  jan and jantx 1n5614 thru 1n5622 vishay semiconductors document number 88833 www.vishay.com 5-mar-02 1 patented* glass passivated rectifiers reverse voltage 200 to 1000v forward current 1.0a formerly ? maximum ratings & thermal characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol prefix j = jan quality level; prefix jx = jantx quality level unit j,jx 1n5614 j,jx 1n5616 j,jx 1n5618 j,jx 1n5620 j,jx 1n5622 maximum repetitive peak reverse voltage v rrm 200 400 600 800 1000 v maximum rms voltage v rms 140 280 420 560 700 v maximum dc blocking voltage v dc 200 400 600 800 1000 v maximum average forward rectified current 0.375 ? (9.5mm) lead length at t a = 55 c i f(av) 1.0 a peak forward surge current 10 surges of 8.3ms each at 1 min. intervals super-imposed on i o = 750ma dc; i fsm 25 a v r = rated v rrm t a = 100 c (per mil-std-750 m 4066) typical thermal resistance (1) r jl 38 c/w r ja 45 operating junction and storage temperature range t j ,t stg ? 65 to +175 c barometric pressure hg 8 33 mm electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. minimum reverse breakdown voltage at 50 av br 220 440 660 880 1100 v maximum instantaneous at 1.0a v f 1.1 v forward voltage tp = 300 s at 3.0a 1.3 maximum dc reverse current t a = 25 c i r 0.5 a at rated dc blocking voltage t a = 100 c25 maximum reverse recovery time at i f = 0.5a, i r = 1.0a, i rr = 0.25a t rr 2.0 s maximum junction capacitance at 4v, 1mhz c j 15 pf notes: (1) thermal resistance from junction to ambient at 0.375 ? (9.5mm) lead length, p.c.b. mounted features  qualified to mil-prf-19500/427  class 1 high temperature metallurgically bonded construction brazed > 600 c  1.0 ampere operation at t a = 55 c with no thermal runaway  typical i r less than 0.1 a  cavity-free, glass passivated junction. in epoxy over hermetic glass  high temperature soldering guaranteed: 350 c/10 seconds, 0.375 (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: do-204al, molded epoxy over glass body (eg1) terminals: solder plated axial leads, solderable per mil-std-750, method 2026 polarity: color band denotes cathode end mounting position: any weight: 0.015oz., 0.4g flammability: epoxy is rated ul 94v-0. 0.107 (2.7) 0.080 (2.0) 0.034 (0.86) 0.028 (0.71) dia. 1.0 (25.4) min. 1.0 (25.4) min. 0.205 (5.2) 0.160 (4.1) dia. * glass-plastic encapsulation technique is covered by patent no. 3,996,602 and brazed-lead assembly by patent no. 3,930,306 do-204al (eg1) dimensions in inches and (millimeters) m i l i t a r y q u a l i f i e d
jan and jantx 1n5614 thru 1n5622 vishay semiconductors formerly www.vishay.com document number 88833 2 5-mar-02 ratings and characteristic curves (t a = 25 c unless otherwise noted) 25 50 75 100 125 150 175 0 0.25 0.5 0.75 1.0 1 10 100 1 10 30 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 10 1 0 20 40 60 80 100 0.01 0.1 1 10 fig. 1 ?forward current derating curve fig. 2 ?typical instantaneous forward characteristics fig. 3 ?typical reverse characteristics fig. 4 ?typical junction capacitance average forward rectified current (a) ambient temperature ( ? c) instantaneous forward current (a) instantaneous forward voltage (v) junction capacitance (pf) reverse voltage (v) instantaneous reverse current ( a) rated peak reverse voltage (%) 60 hz resistive or inductive load 0.375" (9.5mm) lead length pulse width = 300 s 1% duty cycle t j = 25 c t j = 150 c t j = 125 c t j = 25 c t j = 75 c t j = 25 c f = 1.0 mhz vsig = 50m vp-p


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